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HT68F03M/HT68F04M/HT66F03M/HT66F04M 1.5V Battery Flash Type 8-Bit MCU with EEPROM & DC-DC Converter
Features
MCU Features
* Operating voltage: 3.0V (typ.) * Power down and wake-up functions to reduce * EEPROM Memory: 648 * Watchdog Timer function * Up to 8 bidirectional I/O lines * External interrupt line shared with I/O pin * Multiple Timer Module for time measure, input
power consumption
* Five oscillators: - External High Speed Xtal - External 32.768kHz Xtal - External RC - Internal High Speed -- no ext. components - Internal 32kHz -- no ext. components * Multi-mode operation: NORMAL, SLOW, IDLE and
capture, compare match output, PWM output or single pulse output functions
* Comparator function * Dual Time-Base functions for generation of fixed
time interrupt signal
* Low voltage reset function * Low voltage detect function * Multi-channel 12-bit resolution A/D converter
SLEEP
* Fully integrated internal 4MHz, 8MHz and 12MHz * All instructions executed in one or two instruction
cycles
* Table read instructions * 63 powerful instructions * Up to 8 subroutine nesting levels * Bit manipulation instruction * Flash Program Memory: 1K14 ~ 2K15 * RAM Data Memory: 648 ~ 968
DC-DC converter Features
* 3.0V 2.5% output voltage * 0.7V start-up voltage * Output current up to 100mA * High efficiency: 85% (typ.) at VOUT=3V
General Description
This series of devices are Flash Memory type 8-bit high performance RISC architecture microcontrollers. Offering users the convenience of Flash Memory multi-programming features, these devices also include a wide range of functions and features, among which is their internal DC-DC Converter allowing low voltage operation. In addition to their Flash Program Memory there is also area of RAM Data Memory and an area of EEPROM memory for storage of non-volatile data such as serial numbers, calibration data etc. Analog features include a multi-channel 12-bit A/D converter and comparator functions. Multiple and extremely flexible Timer Modules provide timing, pulse generation and PWM generation functions. Protective features such as an internal Watchdog Timer, Low Voltage Reset and Low Voltage Detector coupled with excellent noise immunity and ESD protection ensure that reliable operation is maintained in hostile electrical environments. An extensive choice of oscillator functions is provided including a fully integrated system oscillator which requires no external components for its implementation. The ability to operate and switch dynamically between a range of operating modes using different clock sources gives users the ability to optimise microcontroller operation and minimise power consumption. The devices also include flexible I/O programming features Time-Base functions and a range of other features. The internal PFM type step-up DC-DC Converter allows the MCU to be powered from low voltage sources, and has the advantages of high efficiency and low ripple. With a fixed and accurate 3.0V output voltage and extremely low 0.7V start-up voltage, these MCU devices will be especially suitable for battery-powered applications, portable handheld equipment etc.
Rev. 1.10
1
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Selection Table
Most features are common to all devices, the main feature distinguishing them are Memory capacity, A/D Converter, Timer Module types and stack capacity. The following table summarises the main features of each device.
Part No. HT68F03M HT68F04M HT66F03M Program Memory 1K14 2K15 1K14 Data Memory 648 968 648 Data EEPROM 648 648 648 I/O 8 8 8 Ext. Int. 1 1 1 A/D 3/4 3/4 12-bit4 Timer Module 10-bit CTM1, 10-bit STM1 10-bit CTM1, 10-bit STM1 10-bit CTM1, 10-bit STM1 10-bit CTM1, 10-bit ETM1, 10-bit STM1 Comparator 1 1 1 DC-DC Converter O O O O Stack 4 8 4 Package 16NSOP 16NSOP 16NSOP
HT66F04M
2K15
968
648
8
1
12-bit4
1
8
16NSOP
Block Diagram
The following block diagram illustrates the dual-chip structure of the devices, where an individual MCU and DC-DC Converter devices are combined into a single package.
VDD VOUT
P A 0 /C + /A N 0 P A 1 /C -/A N 1 /V R E F P A 2 /C X /[T P 0 ]/A N 2 P A 3 /IN T /T C K 1 /T P 0 /A N 3 P A 4 /T C K 0 /T P 1 P A 5 /[T P 0 ]/O S C 2 P A 6 /[T C K 0 ]/[T P 1 ]/O S C 1 P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/R E S H T66F0x H T68F0x H T7730 CE LX
VSS
GND
Internal Chip Interconnection Diagram Note that the HT68F0x devices do not contain VREF or ANx A/D converter pins.
Rev. 1.10
2
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Low V o lta g e D e te c t Low V o lta g e R eset
W a tc h d o g T im e r
D C -D C C o n v e rte r
R eset C ir c u it 8 - b it R IS C MCU C o re In te rru p t C o n tr o lle r E x te rn a l R C /X ta l O s c illa to r s
F la s h /E E P R O M P r o g r a m m in g C ir c u itr y
S ta c k
F la s h P ro g ra m M e m o ry
EEPROM D a ta M e m o ry
T im e B a s e
RAM D a ta M e m o ry
In te rn a l R C O s c illa to r 1 2 - B it A /D C o n v e rte r C o m p a ra to rs
I/O
T im e r M o d u le s
Note that the HT68F0x devices do not contain an A/D converter.
Pin Assignment
NC 1 2 3 4 5 6 7 8 P A 3 /IN T /T C K 1 /T P 0 P A 2 /C X /[T P 0 ] P A 1 /C P A 0 /C + VSS GND LX 16 15 14 13 12 11 10 9 NC P A 4 /T C K 0 /T P 1 P A 5 /[T P 0 ]/O S C 2 P A 6 /[T C K 0 ]/[T P 1 ]/O S C 1 P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/R E S VDD PW DN VOUT NC 1 2 3 4 5 6 7 8 H T66F03M 1 6 N S O P -A P A 3 /IN T /T C K 1 /T P 0 /A N 3 P A 2 /C X /[T P 0 ]/A N 2 P A 1 /C -/A N 1 /V R E F P A 0 /C + /A N 0 VSS & AVSS GND LX 16 15 14 13 12 11 10 9 NC P A 4 /T C K 0 /T P 1 P A 5 /[T P 0 ]/O S C 2 P A 6 /[T C K 0 ]/[T P 1 ]/O S C 1 P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/R E S VDD PW DN VOUT & AVDD
H T 6 8 F 0 3 M /H T 6 8 F 0 4 M 1 6 N S O P -A
NC 1 2 3 4 5 6 7 8 P A 3 /IN T /T C K 1 /[T C K 2 ]/T P 0 /A N 3 P A 2 /C X /[T C K 2 ]/[T P 0 ]/[T P 2 B ]/A N 2 P A 1 /[T P 2 A ]/C -/A N 1 /V R E F P A 0 /[T P 2 B ]/C + /A N 0 VSS & AVSS GND LX
16 15 14 13 12 11 10 9
NC P A 4 /T C K 0 /T P 1 P A 5 /[T C K 2 ]/[T P 0 ]/T P 2 B /O S C 2 P A 6 /[T C K 0 ]/[T P 1 ]/T P 2 A /O S C 1 P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/[T P 2 A ]/R E S VDD PW DN VOUT & AVDD
H T66F04M 1 6 N S O P -A
Rev. 1.10
3
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Pin Description
HT68F03M/HT68F04M Pin Name PA0~PA7 CC+ CX TCK0 TCK1 TP0 TP1 INT OSC1 OSC2 RES VDD VSS LX VOUT CE GND NC Note: Port A Comparator input Comparator input Comparator output TM0 input TM1 input TM0 I/O TM1 I/O External Interrupt HXT/ERC/LXT pin HXT/LXT pin Reset pin Power supply Ground Switching input pin DC-DC converter output pin DC-DC converter chip enable, active high Ground Not connected I/T: Input type O/T: Output type OP: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input NS: non-standard input CMOS: CMOS output NMOS: NMOS output SCOM: Software controlled LCD COM AN: Analog input pin HXT: High frequency crystal oscillator LXT: Low frequency crystal oscillator PRM PRM PRM PRM PRM CO CO CO 3/4 3/4 3/4 3/4 3/4 3/4 3/4 CPC CPC Function OP PAWU PAPU I/T ST AN AN 3/4 ST ST ST ST ST HXT/LXT 3/4 ST PWR PWR PWR PWR NS PWR 3/4 O/T CMOS 3/4 3/4 CMOS 3/4 3/4 CMOS CMOS 3/4 3/4 Pin-Shared Mapping 3/4 PA1 PA0 PA2 PA4, PA6 or PA7 PA3 or PA7 PA3, PA5 or PA2 PA4, PA6 or PA7 PA3 or PA7 PA6
HXT/LXT PA5 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 PA7 3/4 3/4 3/4 3/4 3/4 3/4 3/4
Rev. 1.10
4
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
HT66F03M Pin Name PA0~PA7 AN0~AN3 VREF CC+ CX TCK0 TCK1 TP0 TP1 INT OSC1 OSC2 RES VDD AVDD VSS AVSS LX VOUT CE GND NC Note: Port A A/D converter input A/D converter reference input Comparator input Comparator input Comparator output TM0 input TM1 input TM0 I/O TM1 I/O External interrupt HXT/ERC/LXT pin HXT/LXT pin Reset input MCU power supply A/D converter power supply * MCU ground A/D converter ground ** Switching input pin DC-DC converter output pin DC-DC converter chip enable, active high Ground Not connected I/T: Input type O/T: Output type OP: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input NS: non-standard input CMOS: CMOS output NMOS: NMOS output SCOM: Software controlled LCD COM AN: Analog input pin HXT: High frequency crystal oscillator LXT: Low frequency crystal oscillator *: VDD is the device power supply while AVDD is the ADC power supply. The AVDD pin is bonded together internally with VDD. **: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together internally with VSS. 3/4 3/4 3/4 3/4 3/4 PRM PRM PRM PRM 3/4 CO CO CO 3/4 3/4 3/4 CPC Function OP PAWU PAPU ACERL ADCR1 I/T ST AN AN AN AN 3/4 ST ST ST ST ST HXT/LXT 3/4 ST PWR PWR PWR PWR PWR PWR NS PWR 3/4 O/T CMOS 3/4 3/4 3/4 3/4 CMOS 3/4 3/4 CMOS CMOS 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 Pin-Shared Mapping 3/4 PA0~PA3 PA1 PA1 PA0 PA2 PA4, PA6 or PA7 PA3 or PA7 PA3, PA5 or PA2 PA4, PA6 or PA7 PA3 or PA7 PA6
HXT/LXT PA5 PA7 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4
Rev. 1.10
5
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
HT66F04M Pin Name PA0~PA7 AN0~AN3 VREF CC+ CX TCK0 TCK1 TCK2 TP0 TP1 TP2A TP2B INT OSC1 OSC2 RES VDD AVDD VSS AVSS LX VOUT CE GND NC Note: Port A A/D converter input A/D converter reference input Comparator input Comparator input Comparator output TM0 input TM1 input TM2 input TM0 I/O TM1 I/O TM2 I/O TM2 I/O External interrupt HXT/ERC/LXT pin HXT/LXT pin Reset input MCU power supply A/D converter power supply * MCU ground A/D converter ground ** Switching input pin DC-DC converter output pin DC-DC converter chip enable, active high Ground Not connected 3/4 3/4 3/4 3/4 3/4 PRM PRM PRM PRM PRM PRM PRM 3/4 CO CO CO 3/4 3/4 3/4 CPC Function OP PAWU PAPU ACERL ADCR1 I/T ST AN AN AN AN 3/4 ST ST ST ST ST ST ST ST HXT/LXT 3/4 ST PWR PWR PWR PWR PWR PWR NS PWR 3/4 O/T CMOS 3/4 3/4 3/4 3/4 CMOS 3/4 3/4 3/4 CMOS CMOS CMOS CMOS 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 Pin-Shared Mapping 3/4 PA0~PA3 PA1 PA1 PA0 PA2 PA4, PA6 or PA7 PA3 or PA7 PA3, PA5 or PA2 PA3, PA5 or PA2 PA4, PA6 or PA7 PA6, PA1 or PA7 PA5, PA0 or PA2 PA3 or PA7 PA6
HXT/LXT PA5 PA7 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4
I/T: Input type O/T: Output type OP: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input NS: non-standard input CMOS: CMOS output NMOS: NMOS output SCOM: Software controlled LCD COM AN: Analog input pin HXT: High frequency crystal oscillator LXT: Low frequency crystal oscillator *: VDD is the device power supply while AVDD is the ADC power supply. The AVDD pin is bonded together internally with VDD. **: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together internally with VSS.
Rev. 1.10
6
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Functional Description
As these device packages contain multiple internal chips, for a detailed functional description, users must refer to the relevant individual datasheets for both the MCU and the DC-DC Converter. The following table shows which individual devices are inside each package. Device HT68F03M HT68F04M HT66F03M HT66F04M MCU HT68F03 HT68F04 HT66F03 HT66F04 DC-DC Converter HT7730 HT7730 HT7730 HT7730 DC-DC Converter output pin, VOUT is also not connected to the MCU power supply pin, VDD, so these two pins should also be connected together externally. If the DC-DC Converter is used to power the MCU, then the MCU will always have a power supply of 3V, so care must be taken to only consult the MCU characteristics specified at this power supply voltage. If required, the MCU can be supplied directly on its VDD pin by an external power source if the DC-DC converter is not used. When calculating the total current consumption of the device, the internal DC specifications of the two internal chips must be consulted and the individual currents added together. As the MCU power supply may be supplied by the DC-DC Converter it is important to note that if the MCU is powered down or placed into a low power mode to conserve power, that the DC-DC Converter will continue running and will consume a certain amount of power. The DC-DC Converter can of course be powered down by pulling its CE pin low, however as its output voltage falls toward zero, the MCU will experience a reset. The CE pin must therefore be held low for sufficient time to allow the VOUT voltage to fall to a level where the MCU will be properly reset before being powered up again. Multi-chip Programming Considerations As there are no internal signal connections between the two internal chips there are no real programming considerations for these devices. It is only necessary to realise that if the MCU is switched into any of its low power modes or executes the HALT instruction by the application program to reduce power consumption, that the DC-DC Converter will continue operating and therefore contribute to the overall power consumption. The DC-DC Converter can only be powered-down manually using its CE pin and if this is done the MCU will be reset.
Multi-chip Internal Devices Although most of the functional description material will be located in the individual datasheets, there are some special considerations which need to be taken into account when using multi-chip devices. These points will be mentioned in the hardware and software consideration sections. Multi-chip Hardware Considerations As these single-package multi-chip devices are composed of an individual MCU and DC-DC converter chips, using them together requires the user to take care of some special points.
* Absolute Maximum Ratings
The Absolute Maximum Ratings for the two individual chips must be checked for discrepancies and the necessary care taken in device handling and usage.
* Power Supply
Examination of the block diagram will reveal that the DC-DC Converter Ground pin, GND, has no internal connection to the MCU Ground pin, VSS. For this reason these two pins must be connected externally. The
Rev. 1.10
7
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Application Circuits
HT68F03M/HT68F04M Application Circuit
0 .0 1 m F * *
VDD Reset C ir c u it RES PA0 PA1 PA2 PA3 PA4
0 .1 m F
1N4148*
10kW ~ 100kW 300W *
0 .1 ~ 1 m F
VSS
OSC C ir c u it S e e O s c illa to r S e c tio n
OSC1 OSC2
GND
CE
V IN
LX
VOUT
Note:
* Recommended component for added ESD protection. ** Recommended component in environments where power line noise is significant.
Rev. 1.10
8
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
HT66F03M/HT66F04M Application Circuit
0 .0 1 m F * *
VDD Reset C ir c u it RES PA0 PA1 PA2 PA3 /A N /A N /A N /A N PA 1 2 3 4 0
0 .1 m F
1N4148*
10kW ~ 100kW 300W *
0 .1 ~ 1 m F
VSS
OSC C ir c u it S e e O s c illa to r S e c tio n
OSC1 OSC2
GND
CE
V IN
LX
VOUT
Note:
* Recommended component for added ESD protection. ** Recommended component in environments where power line noise is significant.
Rev. 1.10
9
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Package Information
16-pin NSOP (150mil) Outline Dimensions
A 1
16 9 8
B
C C' G H D E F
a
* MS-012
Symbol A B C C D E F G H a Symbol A B C C D E F G H a
Dimensions in inch Min. 0.228 0.150 0.012 0.386 3/4 3/4 0.004 0.016 0.007 0 Nom. 3/4 3/4 3/4 3/4 3/4 0.050 3/4 3/4 3/4 3/4 Dimensions in mm Min. 5.79 3.81 0.30 9.80 3/4 3/4 0.10 0.41 0.18 0 Nom. 3/4 3/4 3/4 3/4 3/4 1.27 3/4 3/4 3/4 3/4 Max. 6.20 3.99 0.51 10.21 1.75 3/4 0.25 1.27 0.25 8 Max. 0.244 0.157 0.020 0.402 0.069 3/4 0.010 0.050 0.010 8
Rev. 1.10
10
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Product Tape and Reel Specifications
Reel Dimensions
T2 D
A
B
C
T1
SOP 16N (150mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.01.0 100.01.5 13.0
+0.5/-0.2
2.00.5 16.8
+0.3/-0.2
22.20.2
Rev. 1.10
11
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Carrier Tape Dimensions
D
E F
P0
P1
t
W C
B0
D1
P A0
K0
R e e l H o le p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . IC
SOP 16N (150mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 16.00.3 8.00.1 1.750.1 7.50.1 1.55 1.50
+0.10/-0.00 +0.25/-0.00
4.00.1 2.00.1 6.50.1 10.30.1 2.10.1 0.300.05 13.30.1
Rev. 1.10
12
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com
Copyright O 2010 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev. 1.10
13
May 24, 2010

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